Position Summary
The Equipment Associate Engineer (DP/ Recon) position reports to the Equipment Lead and is responsible for performing maintenance and repairs on the assigned equipment. The ideal candidate is a good team player, able to work independently, attentive to details and safety, and willing to embrace new task or responsibilities in a dynamic environment.
Responsibilities
- Perform equipment Line Sustaining function (corrective maintenance), preventive maintenance, predictive maintenance, and calibration.
- Sustain and improve overall equipment performance (OEE).
- Update consumables/spare parts to ensure no delay in machine recovery due to no spare.
- Participate and contribute to continuous improvement activities for yield, maintenance cost, equipment modification and productivity improvement.
- Assist Engineers in setting up new machine and buy-off.
- Maintain good housekeeping and safety practices in the cleanroom.
- Communicate with supervisors, fellow shift personnel and vendors to resolve problems.
- Timely update and ensure data integrity of pass down report, PM Checklist and other similar reports, checklists and documents.
- Comply safety standards and procedures during shift duty or working in the production line.
- Responsible for maintenance and repairs on the assigned equipment.
- Provide line sustaining supports to manufacturing such as machine conversion, device setup and jig and tool maintenance.
- Perform, update and document equipment preventive maintenance in-accordance to process and equipment specification.
- Support engineering group on device and recipe creation, equipment buy-off, evaluation, qualification and new product introduction.
- Any other ad-hoc duties as assigned.
Requirements
- Minimum Diploma in Electrical/ Electronics/ Mechanical/ Mechatronics/ Material Science or similar discipline
- Minimum 3 years’ relevant experience in semiconductor/LCD/electronics/electrical industry
- Minimum 3 years’ experience in maintenance and troubleshooting of equipment
- Has hands-on experience in handling equipment for any of the following: Carrier Lamination, Pick and Place, Wafer Saw, Wafer Backgrind, Laser grooving, Wafer Mounting, Taping and Detaping, Molding (Compression, Transfer, or Injection), Oven curing/annealing, metrology tools for wafer/panel inspection in semiconductor industry (packaging assembly).
- Able to work in both day and night rotating shifts, and flexible to work under various shift patterns.