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Module Engineering Process Manager (WET/DF/ETCH/TF/PVD/PHOTOLITHO/METRO)

VISIONPOWER SEMICONDUCTOR MANUFACTURING COMPANY PTE. LTD.

Open D18 Tampines, Pasir Ris $8,000.00 - $13,000.00

Posted: June 20, 2025

Job Description

About VSMC

VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC) is a new joint-venture 300mm semiconductor wafer manufacturing facility to be built in Singapore. We are looking for committed, resilient and passionate talents to launch a promising future that power the next generation devices and systems. If you share the same passion to pursue excellence, join us to make an impact and be part of something special!


Role Summary

You will be responsible for leading and managing process engineering activity within assigned semiconductor wafer fabrication modules, including: Wet, Diffusion, Etch, Thin Film (CMP/CVD), PVD, Photolithography, and Metrology.


Key Responsibilities

  • You will be responsible to lead the respective module team to elevate engineering and manufacturing excellence in the respective modules, improving process, diagnosing failures and implementing effective solutions to meet uptime and cycle time requirements.
  • Qualify and sustain manufacturing processes to scale up capacity swiftly and maintain with quality and urgency.
  • Lead efforts to continuously improve process stability and capability, enhance quality, reliability, yield, productivity, and safety standards.
  • Work with Process integration, Manufacturing, Yield improvement, and Cross-Module team to sustain high quality wafer production and delivery.
  • Develop defense and monitoring system to prevent equipment failure or performance lost.
  • Drive process stability and continuous improvement.

Education Qualification & Essential Experiences

  • A bachelor’s degree or higher in Electrical and Electronics Engineering, Chemical Engineering, Materials Science, Physics, or a related STEM field.
  • Minimum of 6 years of experience in semiconductor process engineering, with deep expertise in the relevant module(s).
  • Experience working in a 12” (300mm) wafer fabrication facility would be advantageous
  • Minimum of 3 years of experience leading engineering teams, with a focus on process engineering in areas such as Wet, Diffusion, Etch, Thin Film (CMP/CVD), PVD, Photolithography, or Metrology.

Key Skills and Attributes

  • Excellent interpersonal and communication skills, with the ability to collaborate effectively across cross-functions and geographically diverse teams.
  • Strong analytical thinking and problem-solving skills capabilities, focused on delivering effective and achieve positive results and outcome.
  • Highly goal-oriened and a strong team player, capable of performing under pressure in a dynamic, fast-paced manufacturing environment.
  • Demonstrates a growth mindset – embracing adaptability, resilience, innovation, and continuous learning to support business needs.

VSMC promotes diversity and inclusivity in our workforce; and hiring will be conducted in phases.

How to Apply

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