Process Engineer (Manufacturing Engineer)

SUMMARY

We are seeking a highly skilled and detail-oriented Process Engineer to develop, optimize, and maintain surface mount assembly processes for printed circuit board assemblies (PCBA). The ideal candidate will ensure high-yield, low-defect production by improving process capability, equipment utilization, and quality assurance.

ESSENTIAL DUTIES AND RESPONSIBILITIES include the following. Other duties may be assigned.

• Develop and maintain SMT assembly processes (screen printing, pick-and-place, reflow soldering, Wave, SPI).

• Analyze and improve process capability (Cp, Cpk), first pass yield (FPY), and overall equipment effectiveness (OEE).

• Define, monitor, and optimize reflow oven thermal profiles for lead and lead-free soldering.

• Drive root cause analysis and corrective actions for process defects (e.g., tombstoning, solder bridging, head-in-pillow).

• Support New Product Introductions (NPI) by establishing process flows, documentation, and line setup.

• Perform DFM/DFT reviews with design and test engineering teams.

• Create and update standard operating procedures (SOPs), work instructions, and training materials.

• Work closely with cross-functional teams including quality, production, R&D, and equipment engineering.

• Ensure compliance with IPC-A-610, J-STD-001, ESD, and other industry standards.

MINIMUM REQUIREMENTS

1) Bachelor's degree in Electronics, Mechanical, Mechatronics, or Industrial Engineering (or related field).

2) 4–6+ years’ experience in SMT or PCBA manufacturing environment.

3) Strong knowledge of SMT machines.

4) Well verse on ISO 134854- Medical requirements. (Will be advantage)