Package Design Engineer is responsible for product and tooling design.
Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.
Responsibilities
- With reference to internal design guidelines, work with the internal & external customer to:
- Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers.
- Generate test vehicle design and the related PCB design.
- Prepare design risk assessment report.
- Generate reticle and stencil design.
- Generate other schematics or drawing as requested.
- Review, maintenance and update the design guidelines.
- Manage the conversion of internal design into suppliers’ final design.
- Document all the drawing revisions and change records.
- Support audits
- Any other ad-hoc duties as assigned
Requirement
- Minimum Master’s Degree in electrical engineering or similar discipline
- Good understanding on the design guidelines and familiar in generating risk assessment report based on Fan-in/ Fan-out process capability
- Experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes will be an advantage
- Hands-on skills on design software tools like Linkcad, Cadence, CAM350, AutoCAD, GDS, Gerber editors
- Experience with PCB test board design
- Fresh graduates are welcome to apply